Huawei Latest Patents – Patents for Scrolling and Chip Stack Packaging Revealed

by admin, Saturday, 7 May 2022 (3 months ago)

The Chinese construction giant, Huawei, is doing quite well in the industry. Because Huawei is a multinational company, the US ban did not have much effect on the company’s operations. Yes, the ban cripples smartphone and tablet businesses, but that’s all it does. In other respects, Huawei is still thriving. This can be seen in its latest patents that reveal the company’s technological trend. Recently, two Huawei patents were released to the public – one is a scroll device patent similar to ancient bamboo, and the other is a patent for a chip stack.

Huawei scroll device patent

With the advent of the original Oppo X 2021 scroll screen phone last November, mobile phone makers have shown great interest in scroll screens. Xiaomi has previously obtained patents related to scroll screens and now Huawei has followed suit.

Huawei patent

According to the State Intellectual Property Office, on May 6, Huawei Technologies Co., Ltd. has a new patent for a “flexible screen support mechanism and rolling electronic equipment”. The overall design of the patent is very similar to that of the ancient bamboos.

The patent summary shows that the device provides a flexible screen support mechanism. The rotating assembly can be reversed and switched between two states. When the rotating assembly is in the first position, the flexible display mount may bend. However, when the rotating assembly is in the second position, the flexible display mount can not bend. The patent application has a simple structure, small storage space and can be applied to portable equipment.

At present, Huawei has manufactured two foldable smartphones with internal and external folding mechanisms. This time, Huawei is exploring new ways to fold flexible screens. Whether or not Huawei will release a scrollable smartphone remains unknown.

However, it is important to note that this is only a patent and there is no guarantee that the device will actually be on the market. Like most patents, it may not see the light of day.

Huawei chip stack packaging patent

Just like the first patent, the State Intellectual Property Office also announced a Huawei patent for “chip stack packaging structure, packaging method and electronics”, which further unveiled Huawei stacked chip technology. The patent is accompanied by application publication number CN114450786A. The application for this patent dates from October 30, 2019. The inventors are Zhang Tonglong, Zhang Xiaodong, Guan Yong and Wang Simin.

Huawei patent

This patent describes a chip stacking packaging structure, a packaging method, and an electronic device. Related to the field of electronic technology that solves the problem of how to reliably connect multiple sub-chip stacking units to the same master chip stacking unit.

Huawei patent

Chip stack package structure

The structure of the chip stack package includes

A master chip stacking unit (10), having a plurality of main pins (11) insulated and spaced on a first surface.

2. The first bonding layer (20) is arranged on the first surface. The first bonding layer (20) comprises a plurality of bonding elements (21) which are insulated and arranged at intervals.

3. Each of the number of welding components (21) comprising at least one welding part (211), any two welding parts (211) supplied separately and the cross-sectional area of ​​any two welding parts (211) being the same;

4. A number of welding assemblies (21) are connected respectively to a plurality of main pins (11).

A plurality of secondary chip stacking units (30) arranged on a surface of the first bonding layer (20) on a side away from the main chip stacking unit (10).

6. The secondary chip stacking unit (30) has a plurality of micro-knobs (31) which are insulated and arranged at intervals.

7. Each of the plurality of micro-knobs (31) is connected to one of a plurality of welding components (21).


In April, a report from Huawei shows a patent for chip stack packaging and terminal equipment. The application publication number is CN114287057A and concerns the field of semiconductor technology. It can solve the problem of high costs due to the use of silicon through technology while ensuring the supply-demand of electricity.

In the press conference of Huawei’s annual report for 2021 in late March, Guo Ping, Huawei’s rotating president, said that in the future, Huawei may adopt a multi-core chip design plan to improve chip performance. At the same time, use the area for performance and the stack for performance. This method allows less advanced technology to continue to make Huawei competitive in future products.

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